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DataRay Inc. Announces WinCamD-IR-BB Broadband 2 to 16 µm MWIR/FIR Beam Profiler System
Press Releases |August 4, 2017
DataRay Inc., the worldwide leader in laser beam profiling and analysis, is pleased to announce the availability of a new, broadband 2 to 16 µm MWIR/FIR beam profiler system: the WinCamD-IR-BB.
Come see us at SPIE BiOS and Photonics West 2017!
Events |January 25, 2017
Come visit DataRay Inc. at SPIE BiOS (booth 8410) and SPIE Photonics West (booth 1840) in San Francisco.
Pulsed Lasers: Pulse Energy & Imager Gain
Pulsed Lasers |January 10, 2017
This is the third entry in a series of blog posts that explore DataRay’s pulsed laser measurement capabilities. This blog post will talk about the energy requirements involved with measuring pulsed lasers, and how the received signal can be controlled when the exposure time is fixed.
Pulsed Lasers and External Trigger Mode
Pulsed Lasers |December 2, 2016
This is the second entry in a series of blog posts that explore DataRay’s pulsed laser measurement capabilities. This blog post will now talk about how an external trigger can be used to formally synchronize the exposure time to the pulse width. This External Trigger mode provides more versatile and precise measurements of pulsed lasers.
Pulsed Lasers and Auto-Trigger Mode
Pulsed Lasers |November 21, 2016
This is the first entry in a series of blog posts that explore DataRay’s pulsed laser measurement capabilities. This blog post will review how capturing pulsed lasers with a camera beam profiler differs from capturing CW lasers, and how the additional challenges with pulsed lasers are handled to provide useful measurements with the software’s Auto-Trigger mode.
Line Laser Profiling System
Specialized Beam Profiling Systems |November 3, 2016
DataRay has always been committed to providing accurate and reliable solutions for characterizing a wide range of laser beams. We take pride in listening to customer requests and working to expand our product line to meet their needs. DataRay is happy to announce our new Line Laser Profiling System (LLPS) with the capability to provide direct measurements of line lasers up to 200 mm in length and down to 55 microns in thickness.