Line Laser Profiling & Analysis
DataRay's specialized beam profiler systems are unique solutions inspired by our customers' needs and applications. The first such system we developed, the Line Laser Profiling System (LLPS) is an excellent solution for direct measurement and analysis of line lasers up to 500 mm in length and down to 55 µm in thickness.
The LLPS's line laser profiling functionality is powered by our full-featured, user-centric software. The DataRay software automatically moves our flagship WinCamD-LCM beam profiling camera across the length of the line laser output using a 50, 200, or 500 mm translation stage to capture and analyze the entire beam. The DataRay software compensates for any residual sensor tilt to ensure an accurate measurement.
A full image of the line laser intensity distribution is generated, along with a vertical centroid plot, line width plot, intensity plots, and several other useful metrics. The software enables the user to generate annotated PDF reports, as well as export the raw data.
If you’re unsure which product is most suitable for your application or have the need for something custom, please contact us.